What is a low temperature Hot Melt?

For case and carton sealing, or end-of-line packaging, most hot melt adhesives are formulated to be run at 350°F, but low-temperature hot melts, sometimes referred to as “low melts” are designed to be run closer to 250°F. In this post, we’ll explore the pros and cons of low-temperature hot melt adhesives to help you make an informed decision for your line.

Pros of Low-Temperature Hot Melt Adhesives

1. Reduced Risk of Burns: One of the main advantages of low-temperature hot melts is that they are considered safer. If an operator accidentally comes into contact with the molten adhesive or the nozzle during production, operating at a lower temperature can be the difference between a hot surface and a serious burn injury.
2. Energy Efficiency: Operating at a lower temperature reduces energy consumption during the melting process. For companies looking to reduce their carbon footprint, using a low-temperature hot melt can be a more environmentally friendly option.
3. Faster Warm Up: A lower operating temperature means it takes less time to start up after breaks, downtime, or shift changeovers.
4. Easier on Equipment: Lower heat means less thermal stress on hoses, nozzles, tanks, and pumps. This can lead to longer lifespans for equipment.

Cons of Low-Temperature Hot Melt Adhesives

1. Bond Strength Limitations: While low-temperature hot melts can be effective for many applications, they may not provide the same level of bond strength as standard temperature adhesives. For heavy-duty packaging or situations requiring high strength on difficult-to-bond substrates, standard-temperature options may be more appropriate.
2. Reduced Heat Resistance: Low-temperature adhesives can be more sensitive to environmental conditions, particularly high-heat environments. If a carton is ever exposed to high heat (140°F+) either in transit or storage, low-temperature hot melts are more susceptible to failure.
3. Limited Variety: The range of low-temperature hot melt adhesives on the market are not as extensive as the offerings for standard-temperature versions. Depending on your specific application, finding the right formulation could be more challenging.

Conclusion

If you value the safety advantage and reduced energy consumption, and are adhering paperboard that is easier to bond and won’t be exposed to high heat, a low-temperature hot melt could be a great option to consider.

If you are bonding a difficult coated paperboard that will be exposed to higher heat, a standard temperature hot melt will suit your needs better.

Capital Adhesives offers both low-temperature and standard-temperature hot melts designed for end-of-line/case and carton sealing. Contact us today to learn more.